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TWS真立体 无线蓝牙耳机方案

 

  

    CMOS Single-chip Fully-integrated RF, PMU,
     Audio CODEC and Cortex-M4F CPU
Bluetooth 5.0 dual mode
Up to 350MHz ARM Cortex-M4F Processor
1MB Serial Flash On-chip for Custom Program  

    Security Boot to Protect Custom IP
3.1V-5.5V Input for VBAT
Internal LPO for Low Power Mode.
DCXO with Internal Oscillator Circuit Support FWS
Support Google Bisto
    Dual MICs Noise Reduction
Echo Cancellation
Support low power voice activity detection
Multi-band EQ and Bass enhancement
Immersive audio with 3D or virtual surround
     sound
Support Active Crossover
Crossover filter: DSP Adjustable
Active Crossover Two-way application:
     Sports Bluetooth
Support Talk through
Support Temperature Sensor 
Support Class H
     24-bit Audio Processing 
HiFi Stereo Audio DAC:
120dB SNR 
110dB DNR 
Supports Rates From 8 KHz to 384 KHz
HiFi Stereo Audio ADC:
100dB SNR

Supports Rates From 8 KHz to 384 KHz  

     Support ambient awareness

3D recording


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